INTRODUCTION: By integrating components, assemblies are engineered that exhibit a
number of advantages against the common designs, such as reduced package size at lower
cost and superior RF performance. A Supercomponent can achieve a volume reduction of 10
to 1, or even more. Electrically, the integration may result into lower transmission loss, flat
attenuation and improved VSWR.
The success of integrated packaging depends on the total understanding and the control of
the components that are supposed to be integrated. Spectrum Elektrotechnik GmbH has an
extensive capability in a variety of passive and active components.
Modular Packaging: Spectrum Elektrotechnik GmbH has an intensive product capability
in devices such as attenuators, limiters, couplers, detectors, filters, power dividers, terminations,
etc. By using this specific component experience, Spectrum Elektrotechnik GmbH can produce
effectively integrated packages, using stripline or microstrip circuitry.
Modular Power Component Packaging: This is a higher level of components integration,
generally used for higher power devices. The components or groups of components are usually
interconnected by special blind mate connectors, integrated directly into the component
housings. Thus, the connectors canīt even been seen, when the components are connected,
providing shortest distance between the components, which is desirable, especially at those
high power levels.
Power Interconnections: Spectrum Elektrotechnik GmbH did design and manufacture two
completely new connector series, the SBX and SBY, and is offering these now to other
manufacturers for modular packaging purposes. Modular Packaging means not only
integration, it furthermore provides the advantage of easy maintainability and replacement
of faulty components. Spectrum Elektrotechnik GmbH has been a leader in modular integration
of high power components.
Example: A High Power Duplexer in a Radar Program did consist of several individual
components: a Circulator, a Load, a Directional Coupler, a Limiter and Drive Circuitry. The
Components were mounted to heat sinks and interconnected by cable assemblies.
For the next generation radar Spectrum Elektrotechnik GmbH was awarded the contract for
a complete redesign: The new space saving design features a compact integration of modular
components. All interconnecting cable assemblies were eliminated, and replaced by using
the connector series SBX and SBY. A drive circuit was added and accommodated into the
limiter housing, together with an over temperature sensor circuit.
In case one of the components becomes defective, or needs to be tested or replaced, only the
locking screws have to be unfastened, and the component can be removed, and replaced,
within no time.
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